Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.
A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.
Please see our support section for the Material Safety Data Sheet for SILVGREASE1.
The StarTech.com Advantage
– Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications
Feature | Feature Value |
---|---|
Product colour | Silver |
Thermal conductivity | 1.93 W/m·K |
Package length | 3.23 mm |
Thermal resistance | 0.12 °C/W |
Evaporation (@ 200°C/24h) | 0.001% |
Bleed (@ 200°C/24h) | 0.05% |
Specific gravity | 1.7 |
RoHS compliance | Y |
Depth | 67 mm |
Weight | 10 g |
Operating temperature (T-T) | -30 – 180 °C |
Package width | 20 mm |
Package depth | 82 mm |
Package height | 153 mm |