OPS Slot-In PCs make digital signage simpler and more flexible without additional cables or devices
The full line-up of OPS Slot-in PCs supports a wide variety of applications starting from static content playback and ranging to the most demanding interactive, high resolution or resource hungry applications. The 6th generation Intel® processors (Skylake) deliver a new class of computing to power the next generation of slot-in computing. The OPS concept provides a compact and fully embedded solution ensuring that all connectors are integrated including power, video & audio signals and RS-232. All NEC large format displays (except E series 32″ to 65″), PX and PH installation projectors feature this option slot.
Delivering Genuine Benefits
– Powerful possibilities – the 6th generation Intel® processors deliver a new class of computing with a host of new features to power the next generation of embedded computing.
– Intel® HD graphics – provides Ultra HD resolution, intense detail and faster frame rates, giving you a remarkable visual experience.
– Industrial grade components – secure high reliability whilst withstanding extreme operating conditions.
– Seamless and fully embedded – as all connectors are inside the display including power, video, audio signals and RS-232, no external cables are required.
– High usage flexibility – thanks to wide connectivity such as 3 x USB, DisplayPort out, Gigabit ethernet and audio.
– Upgrade the power of your displays at any time – savings are possible by upgrading only your OPS device or your display with no need to change all hardware.
– A commitment to quality – tailored warranties available to best match long-term demands by extending standard warranty up to 5 years.
– Economical – enjoy more performance whilst consuming less power.
Feature | Feature Value |
---|---|
Processor frequency | 2.4 GHz |
Processor family | Intel® Celeron® G |
Processor model | G3900E |
Processor cores | 2 |
Processor socket | BGA 1440 |
Processor cache | 2 MB |
Processor cache type | Smart Cache |
System bus rate | 8 GT/s |
Processor threads | 2 |
PCI Express slots version | 3.0 |
Processor lithography | 14 nm |
Processor operating modes | 64-bit |
Stepping | R0 |
Bus type | DMI3 |
Processor codename | Skylake |
Thermal Design Power (TDP) | 35 W |
Processor series | Intel Celeron Processor G3000 Series for Desktop |
Maximum number of PCI Express lanes | 16 |
PCI Express configurations | 1×16,1×8+2×4,2×8 |
Tjunction | 100 °C |
Maximum internal memory supported by processor | 64 GB |
Conflict Free processor | Y |
Memory types supported by processor | DDR3L-SDRAM,DDR4-SDRAM |
Memory clock speeds supported by processor | 1333,1600,1866,2133 MHz |
Memory bandwidth supported by processor (max) | 34.1 GB/s |
ECC supported by processor | Y |
Memory voltage supported by processor | 1.35 V |
Internal memory | 4 GB |
Internal memory type | DDR4-SDRAM |
Maximum internal memory | 16 GB |
Memory slots | 2x SO-DIMM |
Memory clock speed | 2133 MHz |
ECC | Y |
Memory channels | Dual |
Total storage capacity | 64 GB |
Storage media | SSD |
Card reader integrated | N |
SSD interface | M.2 |
SSD capacity | 64 GB |
On-board graphics adapter | Y |
On-board graphics adapter model | Intel® HD Graphics 510 |
On-board graphics adapter family | Intel® HD Graphics |
Maximum on-board graphics adapter memory | 64 GB |
On-board graphics adapter base frequency | 350 MHz |
On-board graphics adapter dynamic frequency (max) | 950 MHz |
On-board graphics adapter DirectX version | 12.0 |
On-board graphics adapter OpenGL version | 4.4 |
On-board graphics adapter ID | 0x1902 |
Discrete graphics adapter model | Not available |
Number of displays supported (on-board graphics) | 3 |
Wi-Fi | N |
Cabling technology | 10/100/1000Base-T(X) |
Ethernet LAN data rates | 10,100,1000 Mbit/s |
Wake-on-LAN ready | Y |
USB 3.0 (3.1 Gen 1) Type-A ports quantity | 3 |
Ethernet LAN (RJ-45) ports | 1 |
DVI port | N |
DisplayPorts quantity | 1 |
Headphone outputs | 1 |
Microphone in | Y |
Motherboard chipset | Intel® HM170 |
Product colour | Black |
Operating system installed | Windows Embedded Standard 7 |
Supported instruction sets | SSE4.1,SSE4.2 |
Processor code | SR2GH |
Intel® vPro™ Technology | N |
Intel® Hyper Threading Technology (Intel® HT Technology) | N |
Intel® Turbo Boost Technology | N |
Intel® Quick Sync Video Technology | Y |
Intel® InTru™ 3D Technology | Y |
Intel® Wireless Display (Intel® WiDi) | Y |
Intel® Clear Video HD Technology (Intel® CVT HD) | Y |
Intel® Insider™ | Y |
Intel® AES New Instructions (Intel® AES-NI) | Y |
Enhanced Intel SpeedStep Technology | Y |
Execute Disable Bit | Y |
Idle States | Y |
Thermal Monitoring Technologies | Y |
Intel Trusted Execution Technology | N |
Scalability | 1S |
Intel Enhanced Halt State | Y |
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) | Y |
Intel VT-x with Extended Page Tables (EPT) | Y |
Embedded options available | Y |
Graphics & IMC lithography | 14 nm |
Intel® Small Business Advantage (Intel® SBA) | N |
Intel TSX-NI | N |
Intel® Secure Key | Y |
Intel 64 | Y |
Intel Stable Image Platform Program (SIPP) | N |
Intel® OS Guard | N |
Intel Virtualization Technology for Directed I/O (VT-d) | Y |
Intel Clear Video Technology | Y |
Intel Software Guard Extensions (Intel SGX) | Y |
Intel Virtualization Technology (VT-x) | Y |
Processor package size | 42 x 28 mm |
Processor ARK ID | 90713 |
Power consumption (typical) | 35 W |
Operating temperature (T-T) | 0 – 40 °C |
Operating relative humidity (H-H) | 0 – 90% |
Certification | CE, FCC |
Width | 200 mm |
Depth | 120 mm |
Height | 30 mm |
Weight | 900 g |
Package width | 260 mm |
Package depth | 190 mm |
Package height | 70 mm |
Package weight | 1 kg |